Estación de retrabajo BGA WDS800A

Semi automatic BGA rework station
August 23, 2024
Breve: Descubra la máquina de reballing BGA láser WDS800A, una solución de última generación para alimentación, soldadura y desoldadura automática de chips. Con sistemas avanzados de calefacción por infrarrojos y aire caliente, control preciso del motor y visión óptica de alta resolución, esta máquina garantiza un retrabajo BGA eficiente y preciso. Perfecto para soldadura sin plomo y reparaciones de PCB de gran tamaño.
Características Relacionadas Del Producto:
  • Automatic chip feeding, pickup, and blowing for seamless operation.
  • Integrated hot air head and mounting head with auto soldering and desoldering functions.
  • Upper heaters with hot air system for faster, even heating and cooling (50-80°C).
  • Lower heaters with Hot air & IR mix heating for quick, even temperature distribution.
  • High-precision slider for accurate BGA and PCB alignment.
  • Preheating table with Germany-imported materials, heat-resistant up to 1800°C.
  • Color high-resolution optical vision system with 22x optical zoom for precise rework.
  • Inbuilt vacuum pump and 360° adjustable suction nozzle for versatile chip handling.
Las preguntas:
  • What is the maximum PCB size the WDS800A can handle?
    The WDS800A can handle PCB sizes up to 630*480mm with no repair dead corners, ensuring efficient repairs for large boards.
  • Does the WDS800A support lead-free soldering?
    Yes, the WDS800A is designed to meet technological requirements for lead-free soldering with its advanced heating systems and precise temperature control.
  • How does the WDS800A ensure accurate alignment during rework?
    The WDS800A features a high-resolution optical vision system with 22x zoom, split vision, and auto-focus, along with motor-controlled X/Y axis movement for precise alignment.